Link : Metal-base CCL(MC PCB) / FR-4 CCL / Prepreg / UL Recognition / RoadMap & Application
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| Metal-base CCL |
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PRODUCT |
TYPE |
PRODUCT STRUCTURE |
SIZE |
DATASHEETS DOWNLOAD |
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Thermal Conductive Prepreg
(TCP)(With glass fiber) k=1.5 ~ 2.0 W/mK
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TCP- A10
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COPPER FOIL : 0.5 ~ 6.0 oz / ft2
THICKNESS of DIELECTRIC : 2.0 ~ 10.0 mil
Aluminum Base :
Aluminum type : 5052 / 1050 /6061 (TCR-A23 exclude 6061)
THICKNESS : 0.8 / 1.0 / 1.5 / 2.0 / 3.0 mm
銅箔 : 0.5 ~ 6.0 oz / ft2
絕緣層厚度 : 2.0 ~ 10.0 mil
鋁基材 :
鋁型號 : 5052 / 1050 /6061 (TCR-A23無6061)
厚度 : 0.8 / 1.0 / 1.5 / 2.0 / 3.0 mm
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460 x 610 mm
510 x 610 mm
540 x 610 mm
510 x 1220 mm
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4 M-CCL
TCP- A10 TCP- A20 TCC- A21 TCC- A22 TCC- A32 TCR- A23
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TCP- A20
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Thermal Conductive Coating
(TCC)(Without glass fiber) k=1.5 ~ 3.0 W/mK
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TCC- A21
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TCC- A22
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TCC- A32
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Thermal Conductive RCC
(TCR)(Resin-Coated Copper) k=2.0 ~ 6.0 W/mK
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TCR- A23
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Thermal Conductive Thin Core(TTC) for Mass Lam use 半成品 – 多層板用
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TTC
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| CCL |
|
PRODUCT |
Tg ℃ |
DESCRIPTIONS & TYPE DATASHEETS DOWNLOAD |
PURCHASING INFORMATION |
|
FR-4 CCL |
SM-730
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140 145 150
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|
Copper foil:
0.3 oz/ft² to 12 oz/ft² (12 μm to 410 μm)
Thickness:
3 mil to 197 mil (0.08 mm to 5.0 mm)
Standard Size:
36.8" x 48.8”
(935mm x 1240mm)
40.8" x 48.8”
(1036mm x 1240mm)
42.8" x 48.8”
(1087mm x 1240mm)
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SM-750
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150
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SM-750
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180
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SM-780
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150 150 180
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SM-560
|
140 150 160 180 180 140 |
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SM-630 (High CTI)
|
140 |
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| Prepreg |
|
PRODUCT |
Tg ℃ |
DESCRIPTIONS |
STANDARD SIZE |
SM-730B-4
| 140
| Tetrafunctional Epoxy Prepreg
|
7628: 1250mm x 150M
1080: 1250mm x 300M
2116: 1250mm x 250M
1506: 1250mm x 150M
SM-750B-5
| 150
| Multifunctional Epoxy Prepreg
SM-750B-7
| 170
| Multifunctional Epoxy Prepreg
SM-750B-8
| 180
| Multifunctional Epoxy Prepreg
SM-560B-4(Halogen-free)
| 140
| Tetrafunctional Epoxy Prepreg
SM-630B-4(High CTI)
| 140
| Tetrafunctional Epoxy Prepreg
| | | | | |
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UL Recognition : UL File No. E199230
Products registered (UL登錄產品型號):
CCL:(Copper Clad Laminate)
SM-730R,SM-730M
SM-750R,SM-750M
SM-560,SM-780,SM-630
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MC-PCB:(Metal Core PCB) Project No.: 11CA42413
M-CCL:(Metal Base Copper Clad Laminate)
SM-A10
SM TCP-A20
SM TCC-A21
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Products under application (UL申請中案件):
CCL:(Copper Clad Laminate)
SM-780: LTTA測試(Upgrade RTI值)
Project No.: 11CA20466
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M-CCL:(Metal Base Copper Clad Laminate)
SM TCC-A22: 申請登錄
Project No.: 10CA65246
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| Product Application: |
|
Computer |
PC,NoteBook,iPad/iPad-like |
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Communication
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CellularPhone/SMP,NetworkDevice |
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Consumer |
LCD TV,LED to shine,DigitalVideo,Wii,PS,X-Box |
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Car |
Instrument Panel,GPS,Event Data Recorder(EDR) |
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Controller/Others |
Controller(ECU),Health-Care Instruments,Calculator |
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