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Link : Metal-base CCL(MC PCB) / FR-4 CCL / Prepreg / UL Recognition / RoadMap & Application
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Metal-base CCL
PRODUCT TYPE PRODUCT STRUCTURE SIZE DATASHEETS DOWNLOAD

Thermal Conductive Prepreg
(TCP)(With glass fiber)
k=1.5 ~ 2.0 W/mK

TCP- A10

        

COPPER FOIL : 0.5 ~ 6.0 oz / ft2 THICKNESS of DIELECTRIC : 2.0 ~ 10.0 mil Aluminum Base : Aluminum type : 5052 / 1050 /6061 (TCR-A23 exclude 6061) THICKNESS : 0.8 / 1.0 / 1.5 / 2.0 / 3.0 mm 銅箔 : 0.5 ~ 6.0 oz / ft2 絕緣層厚度 : 2.0 ~ 10.0 mil 鋁基材 : 鋁型號 : 5052 / 1050 /6061 (TCR-A23無6061) 厚度 : 0.8 / 1.0 / 1.5 / 2.0 / 3.0 mm

460 x 610 mm
510 x 610 mm
540 x 610 mm
510 x 1220 mm

4 M-CCL TCP- A10
TCP- A20
TCC- A21
TCC- A22
TCC- A32
TCR- A23

TCP- A20

Thermal Conductive Coating
(TCC)(Without glass fiber)
k=1.5 ~ 3.0 W/mK

TCC- A21

TCC- A22

TCC- A32

Thermal Conductive RCC
(TCR)(Resin-Coated Copper)
k=2.0 ~ 6.0 W/mK

TCR- A23

Thermal Conductive Thin Core(TTC)
for Mass Lam use
半成品 – 多層板用

TTC


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CCL
PRODUCT Tg ℃ DESCRIPTIONS & TYPE
DATASHEETS DOWNLOAD
PURCHASING INFORMATION

FR-4 CCL

SM-730

140
145
150

Normal FR-4

SM-730-4
SM-730-5
SM-730-E

Copper foil:
0.3 oz/ft² to 12 oz/ft²
(12 μm to 410 μm)

Thickness:
3 mil to 197 mil
(0.08 mm to 5.0 mm)

Standard Size:
36.8" x 48.8”
(935mm x 1240mm)
40.8" x 48.8”
(1036mm x 1240mm)
42.8" x 48.8”
(1087mm x 1240mm)
 


SM-750

150

Lead free soldering

SM-750-5


SM-750

180

High Performance

SM-750-8 CAF
SM-750-8


SM-780

150
150
180

High Performance
(Filler in)

SM-780-5 CAF
SM-780-5 F
SM-780-8 F

SM-560

140
150
160
180
180
140

Green Board
(Halogen free)

SM-560-4 HF
SM-560-5 HF
SM-560-6 HF
SM-560-8 HF
SM-560-8 NF
SM-560-C HF


SM-630
(High CTI)


140

CTI > 600

SM-630-4

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Prepreg
PRODUCT Tg ℃ DESCRIPTIONS STANDARD SIZE

SM-730B-4

140

Tetrafunctional Epoxy Prepreg

7628: 1250mm x 150M
1080: 1250mm x 300M
2116: 1250mm x 250M
1506: 1250mm x 150M

SM-750B-5

150

Multifunctional Epoxy Prepreg

SM-750B-7

170

Multifunctional Epoxy Prepreg

SM-750B-8

180

Multifunctional Epoxy Prepreg

SM-560B-4(Halogen-free)

140

Tetrafunctional Epoxy Prepreg

SM-630B-4(High CTI)

140

Tetrafunctional Epoxy Prepreg


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UL Recognition : UL File No. E199230
Products registered (UL登錄產品型號):

    CCL:(Copper Clad Laminate)
    SM-730R,SM-730M
    SM-750R,SM-750M
    SM-560,SM-780,SM-630

    MC-PCB:(Metal Core PCB) Project No.: 11CA42413
    M-CCL:(Metal Base Copper Clad Laminate)
    SM-A10
    SM TCP-A20
    SM TCC-A21
Products under application (UL申請中案件):

   CCL:(Copper Clad Laminate)
   SM-780: LTTA測試(Upgrade RTI值)
   Project No.: 11CA20466

   M-CCL:(Metal Base Copper Clad Laminate)
   SM TCC-A22: 申請登錄
   Project No.: 10CA65246

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Product Application:
  Computer PC,NoteBook,iPad/iPad-like
  Communication CellularPhone/SMP,NetworkDevice
  Consumer LCD TV,LED to shine,DigitalVideo,Wii,PS,X-Box
  Car Instrument Panel,GPS,Event Data Recorder(EDR)
  Controller/Others Controller(ECU),Health-Care Instruments,Calculator

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